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標準架構(gòu)和板卡設(shè)計

ATCA,MTCA,CPCI,VPX,FMC,AMC,PCIE CRD board, 3U/6U Card，X86(server, PC, Tablet)，ARM(Samsung, TI, Qualcomm…)

高速接口設(shè)計

SATA,USB,LVDS,HDMI,PCIE,XAUI,RXAUI,RapidIO, 

Interlaken,XFI,SFI,SGMII,TMDS, 10GBASE-KR,InfiniBand QDR/FDR,CEI-6G/11G/25G/28G, CAUI

數(shù)模混合設(shè)計

High speed data acquisition card, small signal processing and detection Card, HD video, Conference TV、 monitoring (VGA, HDMI, TMDS) Audio & Video products ,STB,VOIP

RF射頻設(shè)計

Radio-frequency amplifier, frequency converter, mixer, antanna,2G/3G module, GPSWLAN, Wifi, bluetooth, remote sensing, telemetry

高壓高功率設(shè)計

industry power supply, servo motor

HDI設(shè)計

1+N+1, 2+N+2,… , X+N+X design

Mobile、tablet(MTK, Samsung, TI, Intel… )

ATE設(shè)計

Teradyne: j750,Catalyst,Tiger,IFlex,UFlex,J973
Verigy: 93K(512 CH & 1024 CH),83K
Credence: Quartet,LT1101,SC212,Sapphire D10
Advantest: T668X T2000 T6575
LTX: Fusion CX/HFi

封裝基板設(shè)計

Rigid organic package substrate
Flexible packaging substrate
Ceramic package substrate